From design to physical device, Advanced International Technology provides thin film deposition, back-end wafer processing, micro assembly and fabrication services. Prototyping and small to medium builds are our specialty.

• Wafer Dicing
• Wire Bonding
• Assembly
• Machining / Tooling
• Precision Material Cutting
• Micro Machining
• High Precision Surface Grinding
• Precision Glass Cutting
• Thin Film Services
• Solar Array Design
• Magnetic Heads

Applications in Data Storage, Biotechnology, MEMS and Nanotechnology Our engineers and technicians are expert in their field and work with you to achieve your goals. We manufacture your product at a reasonable cost, meeting exacting standards of quality within your time frame.

Last Updated on Thursday, 28 April 2011 23:30