Wafer

Regularly cut wafers up to 8" (200mm) using a DISCO DFD651 8" automatic saw or a DAD5H/2LI 5" manual saw. We can cut within microns accuracy. Depending on the wafer design, larger wafers to 12" (300mm) via quartering can be cut.
The 8" DISCO loads cassettes of 20 wafers at a time. It also auto washes and drys the wafers eliminating excess handling.

High Precision Materials (Ceramics, Ferrite)

Unique Designs of various demensions can be precisely cut with tolerances within a few microns.