From design to physical device, Advanced International Technology provides thin film deposition, back-end wafer processing, micro assembly and fabrication services. Prototyping and small to medium builds are our specialty.

• E-Beam Evaporation - PVD
• Sputtering
• Photolithography
• Lift-off
• Etching
• Wafer Dicing
• Precision Material Cutting
• Micro Machining
• High Precision Surface Grinding
• Annealing
• Glass Bonding
• Assembly
• Wire Bonding
• Precision Glass Cutting
• Honeycomb core cutting

Applications in Data Storage, Biotechnology, MEMS and Nanotechnology

Our engineers and technicians are expert in their field and work with you to achieve your goals. We manufacture your product at a reasonable cost, meeting exacting standards of quality within your timeframe.